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Use of this Specification ensures the consistency of all wafers marking performed by silicon manufacturers
This Guide defines standardized positions for measuring diameter of circular wafers of silicon and other semiconducting materials especially those processed with edge-follower edge-rounding equipment that contain flats or notches (fiducials) on the periphery
SEMI D31-0914 (technical revision)
as well as economic and environmental considerations
Back contact cell and module test methods
E04000 - SEMI E40 - 프로세싱 관리 표준 Revision:SEMI E40-0312 - Superseded Use of this Specification ensuresGlobal Information & Control Technical Committee , 2011 12 24 Global Audits and Reviews Subcommittee . 1995 , 2011 11 . www. semiviews. org www. semi. org 2012 3 . (command) , . , (material processing) , (task) (messaging serives) . , . (misprocessing) , . . (processing jobs) , . (control) , (multi resource) . (jobs) . ( ), . (tuning) (feedforward) (feedback) , (Method) (recipe variable parameters) , (closed loop control) . (handling) (tuning) . ,
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