P03900 - SEMI P39 - Specification for OASIS® – Open Artwork System Interchange Standard Revision:SEMI P39-0308 - Superseded Improving manufacturing efficiency and cost

Improving manufacturing efficiency and cost reductions are critical elements in enabling continued industry advance

1-0302 (technical revision)

previously published March 2010

Many of these scan the wafer periphery and determine the geometric center of the wafer surface

org in July 2006

P03900 - SEMI P39 - Specification for OASIS® – Open Artwork System Interchange Standard Revision:SEMI P39-0308 - Superseded Improving manufacturing efficiency and costThe purpose of this Specification is to define an interchange and encapsulation format for hierarchical integrated circuit mask layout information. Background In the fall of 2001, SEMIs Data Path Task Force formed a working group to define a successor to the venerable GDSII Stream format, which had served the I. C. industry as a de facto standard for layout interchange for more than two decades. The old format, limited by 16 bit and 32 bit internal